Huacan and Sanan usher in new trends in optical communications

Recently, Huacan Optoelectronics and Sanan Optoelectronics have sent new signals about their layout in the field of optical communications. The pace of transformation of traditional LED chip manufacturers into the AI optical communications track is accelerating.

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Huacan Optoelectronics has added the concept of "co-packaged optics (CPO)"

According to news on April 23, Huacan Optoelectronics has added the concept of "co-packaged optics (CPO)" and has been included in the relevant concept section.

According to the company's 2025 annual report, it has officially expanded its strategic focus to the field of optical interconnection in intelligent computing centers and launched the research and development and mass production layout of Micro LED optical modules.

As the core chip platform of BOE, Huacan Optoelectronics relies on the production capacity advantage of the world's first 6-inch Micro LED large-scale mass production line to develop low-power, high-bandwidth optical interconnect modules for AI server scenarios. The company has previously delivered Micro LED optical communication samples to overseas leading customers for verification, and has reached strategic cooperation with display driver chip company Xiangxiang Micro, trying to open up the industrial chain from chip manufacturing to module integration.

Sanan Optoelectronics: Optical chip products for 3.2T optical modules are in the research and development stage

On the same day, Sanan Optoelectronics stated on the investor interaction platform that its optical chip products for 3.2T optical modules are in the research and development stage.

Previously, Sanan Optoelectronics also revealed that the company has officially launched 100G EML chips in the field of high-speed optical chips. This chip can be adapted to 800G mainstream optical module solutions, achieving full-process autonomy from design to manufacturing, and providing key domestic device options for the next generation of AI computing power networks.

In terms of overseas market expansion, Sanan’s CW light source products have passed the certification of leading overseas customers. This series of products covers mainstream power specifications of 70mW and 100mW.

In the field of automotive optical communications, Sanan has developed automotive-grade optical chips that meet harsh environmental requirements, and has reached strategic cooperation with leading downstream companies in the industry chain to jointly promote the industrialization of wide-temperature VCSEL and PD products.

In terms of data center applications, the company's high-speed PD has been shipped in batches, and 100G EML, CW light sources and automotive optical chips have all achieved large-scale delivery capabilities.

In terms of Micro LED optical interconnection technology, Sanan Optoelectronics, Tsinghua University and China Mobile have successfully developed Micro LED light source devices with high-speed modulation capabilities. After testing, the 3dB modulation bandwidth of the device is expected to exceed 7GHz.