Recently, the China Securities Regulatory Commission disclosed a report on the initial public offering and listing guidance filing of Shenzhen Angpai Technology Co., Ltd. (hereinafter referred to as: Angpai Technology). According to the report, on April 26, Guosen Securities and Angpai Technology signed a listing guidance agreement.
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According to the company's official website, Angpai Technology has rich experience in the design and production of liquid cooling and air-cooling heat dissipation products. It is a national high-tech enterprise, an innovative small and medium-sized enterprise in Shenzhen, and a specialized and new "little giant" enterprise of the Ministry of Industry and Information Technology.
It is understood that liquid cooling is a technology that uses liquid as a refrigerant and uses liquid flow to transfer the heat generated by the internal components of the data center IT equipment to the outside of the equipment, so that the heating components of the IT equipment can be cooled, thereby ensuring the safe operation of the IT equipment. The advantages of liquid cooling include ultra-high energy efficiency, ultra-high heat density, efficient heat dissipation, and is not affected by altitude, region, temperature and other environments.
Angpai Technology focuses on the design and manufacturing of e-sports/DIY computer liquid cooling, server/data center liquid cooling, new energy vehicle power battery thermal management, and high-power LED lighting heat dissipation. The company is headquartered in Shenzhen and has two manufacturing bases in Dongguan. Its factory covers an area of 16,700 square meters.
According to Tianyancha, Angpai Technology completed its Series A financing in January 2023. The investors behind it include China Venture Capital, Shenzhen Talent Fund, and Small and Medium-sized Venture Capital. (Compiled by LEDinside)
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